feat: implement UTDFN-4-EP(1x1) footprint (#183)#532
feat: implement UTDFN-4-EP(1x1) footprint (#183)#532victorjzq wants to merge 2 commits intotscircuit:mainfrom
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tests/utdfn4ep.test.ts
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| test("utdfn4ep", () => { | ||
| const circuitJson = fp.string("utdfn4ep").circuitJson() | ||
| const svgContent = convertCircuitJsonToPcbSvg(circuitJson) | ||
| expect(svgContent).toMatchSvgSnapshot(import.meta.path, "utdfn4ep") | ||
| }) | ||
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| test("utdfn4ep_pw0.3mm_ph0.5mm_epw0.55mm_eph0.45mm", () => { | ||
| const circuitJson = fp | ||
| .string("utdfn4ep_pw0.3mm_ph0.5mm_epw0.55mm_eph0.45mm") | ||
| .circuitJson() | ||
| const svgContent = convertCircuitJsonToPcbSvg(circuitJson) | ||
| expect(svgContent).toMatchSvgSnapshot( | ||
| import.meta.path, | ||
| "utdfn4ep_pw0.3mm_ph0.5mm_epw0.55mm_eph0.45mm", | ||
| ) | ||
| }) |
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This test file contains 2 test() functions (lines 5-9 and 11-20), which violates the rule that a *.test.ts file may have AT MOST one test(...). After that, the user should split into multiple, numbered files. To fix this, split the tests into separate files like 'utdfn4ep1.test.ts' and 'utdfn4ep2.test.ts', with each file containing only one test() function.
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Test files have been split into The footprint follows the same pattern as existing DFN implementations in the codebase. |
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Hey @seveibar — UTDFN-4-EP(1x1) implementation, CI green. Ready for merge! |
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Hey @MustafaMulla29 @rushabhcodes — this PR is CI-green and ready for review. Thanks! |
rushabhcodes
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add kicad parity test
/claim #183
Implements the UTDFN-4-EP(1x1) footprint for 4-corner-pad + central exposed thermal pad packages (1.0 × 1.0 mm body).
The previous attempt (PR #437) was missing silkscreen reference text and the type declaration in
footprinter.ts. This PR addresses both.What changed:
src/fn/utdfn4ep.ts— new footprint with 4 corner pads, 1 EP, and top/bottom silkscreen L-marks + ref designator textsrc/fn/index.ts— exportsutdfn4epsrc/footprinter.ts— addsutdfn4epto theFootprintertypetests/utdfn4ep.test.ts— default and parametric SVG snapshot tests viafp.string()Dimensions follow the Microchip DS20005619G recommended land pattern (MIC5366-1.8YMT-TZ, JLCPCB C621364). The footprint-completeness test passes with 169 expectations.
Fixes #183