feat: implement SIP (Single Inline Package) footprint#542
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victorjzq wants to merge 1 commit intotscircuit:mainfrom
Open
feat: implement SIP (Single Inline Package) footprint#542victorjzq wants to merge 1 commit intotscircuit:mainfrom
victorjzq wants to merge 1 commit intotscircuit:mainfrom
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Add sip footprint for single-row through-hole pin packages (e.g., SIP-5, SIP-10). Supports configurable pin count, pitch, hole diameter, and body width. Pin 1 uses a rectangular pad for polarity indication. Addresses sip5_w8.5mm_p2.54mm and sip10_w10mm_p2.54mm items in tscircuit#2
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Hey @seveibar — SIP (Single Inline Package) footprint implementation. CI green and ready for review! |
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/claim #2
Implements the
sipfootprint for Single Inline Package through-hole components (sip5 and sip10 from the breadth checklist).What changed
src/fn/sip.ts: New SIP footprint with configurable pin count (num_pins), pitch (p, default 2.54mm), hole/pad sizes (id/od), and body width (w)src/fn/index.ts: exportssipsrc/footprinter.ts: addssiptype declarationtests/sip1.test.ts: snapshot test forsip5_w8.5mm_p2.54mmtests/sip2.test.ts: snapshot test forsip10_w10mm_p2.54mmExamples
Test plan
bun test tests/sip1.test.tspassesbun test tests/sip2.test.tspassesbun run formatclean