feat: add sc70 footprint as JEDEC MO-203 / SOT-323 alias with correct defaults#550
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victorjzq wants to merge 2 commits intotscircuit:mainfrom
Open
feat: add sc70 footprint as JEDEC MO-203 / SOT-323 alias with correct defaults#550victorjzq wants to merge 2 commits intotscircuit:mainfrom
victorjzq wants to merge 2 commits intotscircuit:mainfrom
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SC-70 (SC-70-3) is the same physical package as SOT-323. Adds a dedicated sc70 function with the correct JEDEC MO-203 defaults: body 2.0mm x 1.25mm, 0.65mm pitch, pad 0.6mm x 0.35mm. Closes tscircuit#2 (sc70_w2.0_h1.25_p0.65mm checklist item)
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| test("sc70", () => { | ||
| const circuitJson = fp.string("sc70").circuitJson() | ||
| const svgContent = convertCircuitJsonToPcbSvg(circuitJson) | ||
| expect(svgContent).toMatchSvgSnapshot(import.meta.path, "sc70") | ||
| }) | ||
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| test("sc70_3", () => { | ||
| const circuitJson = fp.string("sc70_3").circuitJson() | ||
| const svgContent = convertCircuitJsonToPcbSvg(circuitJson) | ||
| expect(svgContent).toMatchSvgSnapshot(import.meta.path, "sc70_3") | ||
| }) | ||
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| test("sc70 custom params", () => { | ||
| const circuitJson = fp | ||
| .string("sc70_w2.0mm_h1.25mm_p0.65mm") | ||
| .circuitJson() | ||
| const svgContent = convertCircuitJsonToPcbSvg(circuitJson) | ||
| expect(svgContent).toMatchSvgSnapshot(import.meta.path, "sc70_custom") | ||
| }) |
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This test file contains 3 test() calls (lines 5, 11, and 17), which violates the rule that a *.test.ts file may have AT MOST one test(...). After that, the user should split into multiple, numbered files. This file should be split into separate files like sc701.test.ts, sc702.test.ts, and sc703.test.ts, with each file containing only one test() call.
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rushabhcodes
requested changes
Mar 19, 2026
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rushabhcodes
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add kicad parity test
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Summary
Adds
sc70as a dedicated footprint for the JEDEC MO-203 package (also known as SC-70 / SOT-323).src/fn/sc70.ts— wrapssot323with SC-70-specific defaultssot323(w, h, p, pl, pw)src/fn/index.tsand typed insrc/footprinter.tsUsage
Why a separate footprint?
SC-70 is the JEDEC name (MO-203) for the same package that NXP calls SOT-323.
Designers searching for "SC-70" would not find
sot323, so a dedicated alias with the correct JEDEC default dimensions is useful.Test plan
bun test tests/sc70.test.ts— 3 variants pass with snapshot generationbun test tests/footprint-completeness.test.ts— completeness check passesbun test— full suite passes (382 tests, 0 fail)Closes #2 (sc70_w2.0_h1.25_p0.65mm checklist item)